NexZM Has Applications In:
Wafer Inspection System
- Detects defects like scratches, particles, and pattern anomalies at wafer level.
- Ensures high yield by identifying issues early in the process.
- Supports both front-end and back-end semiconductor fabs.
Mask Inspection System
- Analyzes photomasks for defects that could transfer onto wafers.
- Ensures lithography accuracy and pattern fidelity.
- Improves device performance by maintaining defect-free masks.
Thin Film Metrology
- Measures film thickness, refractive index, and uniformity
- Ensures process control in deposition and etching steps.
- Critical for advanced nodes requiring precise layer stacking.
Bump Inspection
- Inspects solder bumps for size, height, and shape uniformity.
- Detects missing, bridged, or deformed bumps.
- Essential for flip-chip and advanced packaging reliability.
Package Inspection
- Verifies package integrity, alignment, and surface quality.
- Detects cracks, voids, and contamination.
- Enhances reliability for consumer, automotive, and high-performance chips.
Lead Frame Inspection
- Checks alignment, warpage, and dimensional accuracy of lead frames.
- Ensures proper die attachment and wire bonding quality.
- Prevents electrical and mechanical failures in packaged ICs.
Probe Card Inspection
- Monitors probe tip wear, alignment, and contamination.
- Ensures accurate electrical contact during wafer testing.
- Extends probe card lifespan and reduces false test failures.
Solar Panel Inspection
- Detects micro-cracks, cell misalignment, and surface defects.
- Evaluates uniformity of coatings and metallization.
- Improves efficiency and reliability of photovoltaic modules.
Technical Specifications
| Parameter | Specification |
| Model | NexZM@ |
| Measurement Area (X,Y) | 300 × 300 mm |
| Overall Dimensions (mm) | 2610 × 1400 × 2030 |
| Stage X/Y Positioning Accuracy | ≤ 80 µm |
| Stage Flatness | ≤ 50 µm |
| Stage Leveling | ≤ 50 µm |
Key Features
- Guarantees absolute accuracy, reproducibility, and system-to-system matching across fabs.
- SECS/GEM protocol compliant, ensuring smooth fab integration.
- Capable of thickness, surface roughness, and warpage measurement.
- Compatible with server or desktop, offering easy integration with external systems using Industrial Ethernet and Modbus TCP/IP interfaces.