NexZM: Wafer and Die Measurement System
Non-contact wafer inspection system providing precise height measurements after critical processes including lithography, deposition, CMP, etch, Dicing, Chip Mounting, and Wire Bonding for optimal manufacturing control and quality assurance.
Chemical & Slurry Distribution System
The Chemical Distribution Module (CDM) is a high-precision, fully automated system engineered to deliver ultra-pure process chemicals to semiconductor tools with maximum reliability and safety. Designed to meet the demanding standards of advanced fabs, the CDM ensures consistent chemical flow, precise dosing, and contamination-free distribution, empowering fabs to achieve higher yields and tighter process control.
Equipment – Front End Module – Industry 4.0
The Equipment Front End Module (E-FEM) is a precision-engineered wafer handling platform designed to seamlessly integrate with semiconductor process equipment. E-FEM ensures reliable wafer transfer, strict contamination control, and high-throughput operation in advanced manufacturing environments.
Building Management System (BMS)
The Building Management System (BMS) is an intelligent, centralized platform designed to monitor, control, and optimize a facility’s critical infrastructure. From HVAC and lighting to energy, security, and safety systems, the BMS integrates diverse building operations into a single interface—delivering comfort, efficiency, and sustainability across commercial, industrial, and mission-critical environments.
Predictive Maintenance Systems
The Predictive Maintenance System is an AI-powered platform that helps organizations anticipate equipment failures before they happen—reducing downtime, extending asset life, and lowering maintenance costs. By combining IoT sensors, real-time monitoring, and advanced analytics, the system identifies patterns and anomalies to predict when machines require service, ensuring maximum reliability and performance.
Defect Detection System
Our Defect Detection System (DDS) is a state-of-the-art inspection solution designed to identify and classify defects across the semiconductor manufacturing process. From front-end wafer fabrication to back-end packaging, DDS ensures higher yield, reduced scrap, and faster time-to-market by combining advanced imaging technologies with AI-driven analytics.
Delivering Precision at Every Wafer Stage
Our suite of semiconductor metrology and automation products empowers fabs with unmatched accuracy, throughput, and reliability, ensuring critical process control from lithography through final assembly.
Modular Architecture
Customize metrology units for die inspection, film analysis, or post-dicing without tool replacements.
Seamless Integration
Instant SECS/GEM and Modbus TCP/IP connectivity for rapid deployment and real-time data flow.
Automated Data Analysis
Built-in analytics provide actionable film thickness, warpage, and groove depth insights.